Released
Data Sheet
PMC-2000164
ISSUE 3
PMC-Sierra, Inc.
PM9311/2/3/5 ETT1™ CHIP SET
ENHANCED TT1™ SWITCH FABRIC
2.5.2
Package Dimensions
This section outlines the mechanical dimensions for the Dataslice device. The package is a 474 ceramic
ball grid array (CBGA).
NOTE:
Drawings are not to scale.
Figure 56. Dataslice CBGA Package Dimensions - Top and Side Views
D
D1
E1
E
Top View
Pin A01 corner
A
A1
A2
aaa
Side View
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE
147