欢迎访问ic37.com |
会员登录 免费注册
发布采购

24IMS6-05-9 参数 Datasheet PDF下载

24IMS6-05-9图片预览
型号: 24IMS6-05-9
PDF下载: 下载PDF文件 查看货源
内容描述: 6瓦特贴片和通孔的DC / DC转换器 [6 Watt SMD and through hole DC/DC converters]
分类和应用: 转换器
文件页数/大小: 13 页 / 1280 K
品牌: POWER-ONE [ POWER-ONE ]
 浏览型号24IMS6-05-9的Datasheet PDF文件第5页浏览型号24IMS6-05-9的Datasheet PDF文件第6页浏览型号24IMS6-05-9的Datasheet PDF文件第7页浏览型号24IMS6-05-9的Datasheet PDF文件第8页浏览型号24IMS6-05-9的Datasheet PDF文件第9页浏览型号24IMS6-05-9的Datasheet PDF文件第10页浏览型号24IMS6-05-9的Datasheet PDF文件第11页浏览型号24IMS6-05-9的Datasheet PDF文件第12页  
Industrial Environment  
DC/DC Converters < 40W  
IMS6 Series  
Description of Options  
Table 16: Survey of options  
Option  
Function of option  
Characteristic  
Z
M
K
Available in 'open frame' version without case  
Surface mount version, SMD  
Alternative pinout  
Bare board construction without case. Consult factory.  
Not available for 5 IMX 4 and 70 IMX 4 types  
Not available for 5 IMX 4 and 70 IMX 4 types as well as all types  
with 3.3 V or 24 V outputs  
Option K  
Alternative pinout.  
Option M  
Surface mount version.  
This option defines an alternative pinout.  
Option K excludes option M and vice versa.  
Note: Precautions should be taken when reflow soldering  
the SMD version, option M. The reflow soldering instruc-  
tions below should be strictly adhered to. An inadequate  
soldering process may permanently damage the converter  
or degrade its performance and Melcher will not honour any  
guarantee/warranty claims resulting from damage caused  
by ignoring the soldering instructions.  
24  
1
Infrared soldering is not permitted.  
The surface mountable version of this product is assem-  
bled with high melting point solder (227 C) to ensure that  
the solder joints of of the internal components do not de-  
grade in the end users SMD soldering process.  
This product is only specified for "Forced Convection  
Reflow Soldering" (Hot Air). Any conventional soldering  
profile is acceptable provided that the restriction curve be-  
low is not exceeded at any time during the reflow process.  
12  
13  
2.5  
26.6  
Tpeak [ C]  
11051  
240  
235  
230  
Fig. 25  
Proposed solder lands.  
225  
220  
215  
210  
t
[s]  
205  
50  
0
20  
30  
40  
10  
Fig. 24  
Forced convection reflow soldering restriction curve  
measured on pin 2  
Edition 1 06.00