TNY253/254/255
SMD-8 (G Package)
D S .004 (.10)
DIM
Inches
mm
8
5
-E-
A
B
C
G
H
J1
J2
J3
J4
K
0.367-0.387
0.240-0.260
0.125-0.145
0.004-0.012
0.036-0.044
0.057-0.068
0.048-0.053
0.032-0.037
0.007-0.011
0.010-0.012
0.100 BSC
0.030 (MIN)
0.372-0.388
0-8°
9.32-9.83
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
2.54 BSC
0.76 (MIN)
9.45-9.86
0-8°
.420
P
B
.046
.060 .046
.060
.080
L
M
P
Pin 1
1
4
L
.086
.186
.286
α
A
-D-
Solder Pad Dimensions
M
J1
Notes:
1. Package dimensions conform to JEDEC
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
flash or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on
any side.
C
K
-F-
.004 (.10)
H
J3
J4
.010 (.25) M A S
α
G
4. D, E and F are reference datums on the
molded body.
G08A
J2
PI-2077-040110
Revision
Notes
Date
A
-
02/99
1. Leading edge blanking time (tLEB) typical and minimum values increased to improve design flexibility.
2. Minimum DRAIN supply current (IS1, IS2) eliminated as it has no design revelance.
B
C
07/01
1. Updated package reference.
2. Corrected VR1 in Figure 12.
3. Corrected storage temperature, θJA and θJC and updated nomenclature in parameter table.
4. Corrected spacing and font sizes in figures.
1. Corrected θJA for P/G package.
2. Updated DIP-8 and SMD-8 Package Drawings.
3. Figure 10 caption and text description modified.
D
E
04/03
02/12
1. Changed SOA limit.
Rev E
02/12
16
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