SLVU2.8
Only One Name Means ProTek’Tion™
APPLICATION INFORꢀATION
I/O LINE
1
2
3
GND
FIGURE 1 - UNIDIRECTIONAL COꢀꢀON ꢀODE PROTECTION
Circuit connecꢀvity is as follows:
• Line 1 connected to Pin 3.
• Pins 1 and 2 connected to ground.
I/O LINE
1
2
2
1
3
D1
3
D2
GND
GND
FIGURE 2 - BIDIRECTIONAL COꢀꢀON ꢀODE PROTECTION
Two SLUV2.8 devices used in parallel. Circuit connecꢀvity is as follows:
• Line 1 connected to Pin 1 of Device 1 and Pin 2 connected to Device 2.
• Pin 2 of Device 1 and Pin 1 of Device 2 connected to ground.
• Pin 3 of both Devices not connected.
I/O LINE 1
1
2
2
1
3
D1
3
D2
I/O LINE 2
FIGURE 3 - BIDIRECTIONAL DIFFERENTIAL ꢀODE PROTECTION
Two SLUV2.8 devices used in parallel. Circuit connecꢀvity is as follows:
• Line 1 connected to Pin 1 of Device 1 and Pin 2 connected to Device 2.
• Line 2 connected to Pin 2 of Device 1 and Pin 1 of Device 2.
• Pin 3 not connected.
CIRCUIT BOARD RECOꢀꢀENDATIONS
Circuit board layout is criꢀcal for electromagneꢀc compaꢀbility protecꢀon. The following guidelines are recommended:
• The protecꢀon device should be placed near the input terminals or connectors, the device will divert the transient current
immediately before it can be coupled into the nearby traces.
• The path length between the TVS device and the protected line should be minimized.
• All conducꢀve loops including power and ground loops should be minimized.
• The transient current return path to ground should be kept as short as possible to reduce parasiꢀc inductance.
• Ground planes should be used whenever possible. For mulꢀlayer PCBs, use ground vias.
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