AND4GA
Ultra Bright LED Lamps: Type 2
Weight: 2.0 mg
Unit: mm
AND4GA
Cathode
Index
1.25
1.1
0.6
GaP Ultra Bright Green Light Emission
Surface Mount Package
Features
• Small package size
• 2.0 (l) x 1.25 (w) x 1.1 (h) size
• Suitable for DIP and REFLOW soldering
• Recommended Forward Current: 10 mA
• RoHS Compliant
Maximum Ratings (T
a
= 25°C)
Characteristics
Symbol
I
F
V
R
P
D
T
Opr
T
Stg
2.0
1.4
Rating
30
5
100
-40 to 85
-40to 90
Unit
mA
V
mW
°C
°C
0.4±0.2
Forward Current
Reverse Voltage
Power Dissipation
Polarity
R0.2
Operating Temperature Range
Storage Temperature Range
Electro-Optical Characteristics (T
a
= 25°C)
Characteristics
Forward Voltage
Reverse Current
Luminous Intensity
Peak Emission Wavelength
Spectral Line Half Width
Dominant Wavelength
Full Viewing Angle
Precaution
Symbol
V
F
I
R
I
V
l
P
∆λ
λ
d
θ
Test Condition
I
F
= 20 mA
V
R
= 5 V
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
F
= 20 mA
I
V
= 1/2 Peak
Minimum
–
–
8.0
–
–
–
–
Typical
2.1
–
15
570
30
571
140
Maximum
2.4
10
–
–
–
–
–
Unit
V
µA
mcd
nm
nm
nm
degree
Please be careful of the following:
1. Manual soldering: maximum temperature of iron tip: 260°C max.
Soldering time: within 5 sec. per solder-land
Soldering portion of lead: up to 1.6 mm from the body of the device
2. Reflow solder: recommended condition is as follows:
10 sec. max.
Temperature
140 - 160°C
230°C max.
Product specifications contained herein may
be changed without prior notice.
It is therefore advisable to contact Purdy
Electronics before proceeding with the design
of equipment incorporating this product.
The following soldering patterns are
recommended for reflow soldering
Reflow
more than 2 min.
Time
4°C/sec.
max.
1.2
0.9
1.2
Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085
Tel: 408.523.8200 • Fax: 408.733.1287 • sales@purdyelectronics.com
1.2
7/18/07
www.purdyelectronics.com