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HYB18TC1G800AF 参数 Datasheet PDF下载

HYB18TC1G800AF图片预览
型号: HYB18TC1G800AF
PDF下载: 下载PDF文件 查看货源
内容描述: 1千兆位DDR2 SDRAM [1-Gbit DDR2 SDRAM]
分类和应用: 动态存储器双倍数据速率
文件页数/大小: 54 页 / 3010 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet  
HYB18TC1G[80/16]0AF  
1-Gbit DDR2 SDRAM  
1.2  
Description  
The 1-Gb DDR2 DRAM is a high-speed Double-Data-Rate-  
Two CMOS Synchronous DRAM device containing  
1,073,741,824 bits and internally configured as anoctal quad-  
bank DRAM. The 1-Gb device is organized as either 16 Mbit  
×8 I/O ×8 banks or 8 Mbit ×16 I/O ×8 banks chip. These  
synchronous devices achieve high speed transfer rates  
starting at 400 Mb/sec/pin for general applications. See  
Table 1 to Table 3 for performance figures.  
CK falling). All I/Os are synchronized with a single ended  
DQS or differential DQS-DQS pair in a source synchronous  
fashion.  
A 17 bit address bus for ×4 and ×8 organised components  
and a 16 bit address bus for ×16 components is used to  
convey row, column and bank address information in aRAS-  
CAS multiplexing style.  
The DDR2 device operates with a 1.8 V ± 0.1 V power  
supply. An Auto-Refresh and Self-Refresh mode is provided  
along with various power-saving power-down modes.  
The device is designed to comply with all DDR2 DRAM key  
features:  
1. Posted CAS with additive latency  
2. Write latency = read latency - 1  
3. Normal and weak strength data-output driver  
4. Off-Chip Driver (OCD) impedance adjustment  
5. On-Die Termination (ODT) function  
The functionality described and the timing specifications  
included in this data sheet are for the DLL Enabled mode of  
operation.  
The DDR2 SDRAM is available in PG-TFBGA package.  
All of the control and address inputs are synchronized with a  
pair of externally supplied differential clocks. Inputs are  
latched at the cross point of differential clocks (CK rising and  
TABLE 4  
Ordering Information for RoHS compliant products  
Product Type  
Org. Speed  
CAS-RCD-RP Latencies1)2)3)  
Clock (MHz) Package  
HYB18TC1G160BF–3S  
HYB18TC1G800BF–3S  
HYB18TC1G160BF–3.7  
HYB18TC1G800BF–3.7  
HYB18TC1G160BF–5  
HYB18TC1G800BF–5  
×16 DDR2–667D 5–5–5  
333  
333  
266  
266  
200  
200  
PG–TFBGA–92–1  
×8  
×16 DDR2–533C 4–4–4  
×8 DDR2–533C 4–4–4  
×16 DDR2–400B 3–3–3  
×8 DDR2–400B 3–3–3  
DDR2–667D 5–5–5  
PG–TFBGA–68–3  
PG–TFBGA–92–1  
PG–TFBGA–68–3  
PG–TFBGA–92–1  
PG–TFBGA–68–3  
1) CAS: Column Address Strobe  
2) RCD: Row Column Delay  
3) RP: Row Precharge  
Note: For product nomenclature see Chapter 9 of this data sheet  
Rev. 1.11, 2006-09  
5
03292006-PJAE-UQLG