HYB25D256800CT-5 参数 Datasheet PDF下载

Internet Data Sheet

HY[B/I]25D256[16/40/80]0C[E/C/F/T](L)

256 Mbit Double-Data-Rate SDRAM

TABLE 3

Ordering Information for Lead-Containing Products

Product Type

1)

Oganization CAS-RCD-RP Clock (MHz) Speed

Latencies

×4

×8

×16

×4

×8

×16

×4

×4

×8

×16

×4

×8

×16

×8

×16

×8

×16

×8

×16

×8

×16

2.5-3-3

166

DDR333

3-3-3

200

DDR400A P-TFBGA-60

2.5-3-3

166

DDR333

3-3-3

200

DDR400B P-TSOPII-66 —

2.5-3-3

166

DDR333

3-3-3

143

200

DDR266A

DDR400B P-TFBGA-60

2.5-3-3

166

DDR333

3-3-3

200

Package

Note

Standard Temperature Range (0

°C

- +70

°C)

HYB25D256400CT–5

HYB25D256800CT–5

HYB25D256160CT–5

HYB25D256400CT–6

HYB25D256800CT–6

HYB25D256160CT–6

HYB25D256400CT–7

HYB25D256400CC–5

HYB25D256800CC–5

HYB25D256160CC–5

HYB25D256400CC–6

HYB25D256800CC–6

HYB25D256160CC–6

HYI25D256800CT–5

HYI25D256160CT–5

HYI25D256800CT–6

HYI25D256160CT–6

HYI25D256800CC–5

HYI25D256160CC–5

HYI25D256800CC–6

HYI25D256160CC–6

DDR400B P-TSOPII-66 —

HYB25D256800CTL–6

×8

Industrial Temperature Range (–40

°C

- +85 °C)

1) HYB and HYI: designator for memory components; 25D: DDR SDRAMs at

V

DDQ

= 2.5 V; 256: 256-Mbit density; 400/800/160: product

variations

×4, ×8

and

×16;

C: die revision C; L: low power (available on request); F/C/E/T: package type FBGA (lead & halogen free),

FBGA (lead containing), TSOP (lead & halogen free), and TSOP (lead containing)

Rev. 2.3, 2007-03

03062006-8CCM-VPUW

6