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HYS64D32020GDL-5-C 参数 Datasheet PDF下载

HYS64D32020GDL-5-C图片预览
型号: HYS64D32020GDL-5-C
PDF下载: 下载PDF文件 查看货源
内容描述: 200针的小型双列直插式内存模块 [200-Pin Small Outline Dual-In-Line Memory Modules]
分类和应用: 存储内存集成电路动态存储器双倍数据速率时钟
文件页数/大小: 34 页 / 1787 K
品牌: QIMONDA [ QIMONDA AG ]
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Internet Data Sheet
HYS64D[32/16]0x0[G/H]DL–[5/6]–C
Small-Outline DDR SDRAM Modules
1.2
Description
the PC board. The DIMMs feature serial presence detect
based on a serial E2PROM device using the 2-Pin I2C
protocol. The first 128 bytes are programmed with
configuration data and the second 128 bytes are available to
the customer.
The
HYS64D3 2020 [H/G]DL –5– C
and
HYS64D[32/16]0x0[H/G]DL–6–C are industry standard
200-Pin Small Outline Dual-In-Line Memory Modules (SO-
DIMMs) organized as 32M
×
64. The memory array is
designed with Double Data Rate Synchronous DRAMs (DDR
SDRAM). A variety of decoupling capacitors are mounted on
TABLE 2
Ordering Information for Lead Containing Products
Product Type
PC3200 (CL=3.0)
HYS64D32020GDL–5–C
PC2700 (CL=2.5)
HYS64D16000GDL–6–C
HYS64D32020GDL–6–C
PC2700S–2533–0–C1
PC2700S–2533–0–A1
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
256 Mbit (×16)
256 Mbit (×16)
PC3200S–3033–1–A1
two ranks 256 MB SO-DIMM
256 Mbit (×16)
Compliance Code
Description
SDRAM Technology
TABLE 3
Ordering Information for RoHS Compliant Products
Product Type
1)
PC3200 (CL=3.0)
HYS64D32020HDL–5–C
PC2700 (CL=2.5)
HYS64D16000HDL–6–C
HYS64D32020HDL–6–C
PC2700S–2533–0–C1
PC2700S–2533–0–A1
one rank 128 MB SO-DIMM
two ranks 256 MB SO-DIMM
256 Mbit (×16)
256 Mbit (×16)
PC3200S–3033–1–A1
two ranks 256 MB SO-DIMM
256 Mbit (×16)
Compliance Code
Description
SDRAM Technology
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Notes
1. Allproduct types end with a place code designating the silicon-die revision. Reference information available on request.
Example: HYS64D32020GDL-6-C, indicating rev. C dies are used for SDRAM components.
2. The Compliance Code is printed on the module labels describing the speed sort (for example “PC2700”), the latencies and
SPD code definition (for example “2033–0” means CAS latency of 2.0 clocks, RCD
1)
latency of 3 clocks, Row Precharge
latency of 3 clocks, and JEDEC SPD code definiton version 0), and the Raw Card used for this module.
1) RCD: Row-Column-Delay
Rev. 1.31, 2006-09
03292006-VN6D-DETI
4