Internet Data Sheet
HYS64D[32/64][000/020]HDL–[5/6]–C
Small-Outline DDR SDRAM Modules
1
Overview
This chapter gives an overview of the 200-Pin Small-Outline Dual-In-Line Memory Modules product family and describes its
main characteristics.
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Features
Non-parity 200-Pin Small-Outline Dual-In-Line Memory Modules
One rank 32M
×64
and two ranks 64M
×64
organization
Standard Double Data Rate Synchronous DRAMs ( )
Single +2.5 V (± 0.2 V) power supply and +2.6 V (± 0.1 V) for DDR400
Built with 512 Mbit s organized as
×16
in P–TSOPII–66 packages
Programmable CAS Latency, Burst Length, and Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All inputs and outputs SSTL_2 compatible
Serial Presence Detect with E
2
PROM
Standard form factor: 67.60 mm
×
31.75 mm
×
3.80 mm
Standard reference layout Raw Cards A and C
Gold plated contacts
RoHS Compliant Products
1)
TABLE 1
Performance
Part Number Speed Code
Speed Grade
max. Clock
Frequency
Component
Module
@CL3
@CL2.5
@CL2
f
CK3
f
CK2.5
f
CK2
–5
DDR400B
PC3200–3033
200
166
133
–6
DDR333B
PC2700–2533
166
166
133
–7
DDR266A
PC2100–2033
–
143
133
Unit
—
—
MHz
MHz
MHz
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.11, 2006-09
03292006-428D-USV0
3
QIMONDA [ QIMONDA AG ]
