Internet Data Sheet
HYS[64/72]T256020EU-[25F/2.5/3/3S/3.7]-B
Unbuffered DDR2 SDRAM Module
1
Overview
This chapter gives an overview of the 240-Pin unbuffered DDR2 SDRAM Modules product family and describes its main
characteristics.
1.1
Features
•
•
•
•
•
•
•
•
•
•
Auto Refresh (CBR) and Self Refresh
Programmable self refresh rate via EMRS2 setting
Programmable partial array refresh via EMRS2 settings
DCC enabling via EMRS2 setting
All inputs and outputs SSTL_1.8 compatible
Off-Chip Driver Impedance Adjustment (OCD) and On-Die
Termination (ODT)
Serial Presence Detect with E
2
PROM
UDIMM and EDIMM Dimensions (nominal):
30 mm high, 133.35 mm wide
Based on standard reference layouts Raw Card “E” and
“G”
RoHS compliant products
1)
• 240-Pin PC2–6400, PC2–5300 and PC2–4200 DDR2
SDRAM memory modules.
• 256M
×
64 and 256M
×72
module organization,and
128M
×
8 chip organization
• Standard Double-Data-Rate-Two Synchronous DRAMs
(DDR2 SDRAM) with a single + 1.8 V (± 0.1 V) power
supply
• 2 GB Built with 1Gbit DDR2 SDRAMs in and
P-TFBGA-68-6 chipsize packages
• All speed grades faster than DDR400 comply with
DDR400 timing specifications.
• Programmable CAS Latencies (3, 4, 5 and 6), Burst
Length (8 & 4) and Burst Type
• Average Refresh Period 7.8
µs
at a
T
CASE
lower than 85°C,
3.9µs between 85°C and 95°C.
TABLE 1
Performance Table
Product Type Speed Code
Speed Grade
Max. Clock Frequency
@CL6
@CL5
@CL4
@CL3
Min. RAS-CAS-Delay
Min. Row Precharge Time
Min. Row Active Time
Min. Row Cycle Time
–25F
PC2–6400
5–5–5
–2.5
PC2–6400
6–6–6
400
333
266
200
15
15
45
60
–3
PC2–5300
4–4–4
–
333
333
200
12
12
45
57
–3S
PC2–5300
5–5–5
–
333
266
200
15
15
45
60
–3.7
PC2–4200
4–4–4
–
266
266
200
15
15
45
60
Unit
—
MHz
MHz
MHz
MHz
ns
ns
ns
ns
f
CK6
f
CK5
f
CK4
f
CK3
t
RCD
t
RP
t
RAS
t
RC
400
400
266
200
12.5
12.5
45
57.5
1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined
in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,
lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.
Rev. 1.0, 2006-10
10262006-SX8C-DEY8
3