QUALCOMM
CHIPSET
SOLUTIONS
CONVERGENCE
E N H A N C E D M U LT I M E D I A
M U LT I M E D I A
VA L U E
QSC6270™
Single-Chip Solution
Mainstream mobile broadband expands globally with industry’s first
single-chip solution for HSDPA and WCDMA (UMTS) networks
The QSC6270
™
solution will help drive the rapid adoption of high-speed mobile broadband around the world as
the world’s first single-chip solution supporting HSDPA/WCDMA (UMTS) and GSM/GPRS/EDGE networks. A complete
system solution with integrated video, audio, graphics and multimedia capabilities, the QSC6270 solution enables
sleek, must-have devices that reflect smart design without compromising on power and functionality.
As part of the QUALCOMM Single-Chip (QSC) family, the QSC6270 solution integrates four functions that typically
require separate ICs—baseband modem, RF transceiver, power management, and multimedia processor— into a single
chip. This unsurpassed level of integration offers device manufacturers the benefits of lower bill-of-material (BOM) costs,
significant board-area savings, and simplified design for shorter time-to-market. Manufacturers who use QSC solutions
can offer devices with smaller, sleeker form-factors that offer a wide range of in-demand features at lower price points—
all with significant power savings. Stylish designs with broadband data rates and compelling wireless multimedia
capabilities ranging from 3.0 megapixel camera for album-quality snapshots, easy-to-use MP3 tunes and more, can
now be available in the mass-market tier.
MOBILE BROADBAND SPEEDS IN A SINGLE-CHIP SOLUTION TO DRIVE THE RAPID DEVELOPMENT
AND ADOPTION OF HIGH-SPEED WIRELESS DATA AND MULTIMEDIA APPLICATIONS
PERFORMANCE
Maximize design and development potential
• Air interfaces supported:
- HSDPA 3.6 Mbps peak rate category
5/6 + Equalizer
- WCDMA (UMTS) R99
- GSM Release 4
- GPRS/EGPRS Multislot Class 12, Release 4
- DTM Multislot Class 11
- GPS
• QVM
™
Java
®
environment platform with
multitasking virtual machine (MVM) and ARM’s
Jazelle
™
Java acceleration speeds execution
of multiple, concurrent games and applets
• Enhanced memory support for NAND
and SDRAM
• Advanced 0.5 mm pitch CSP packaging
technology
• Integrated secure boot, secure software
and secure storage
• Open BREWapi
™
software to run uiOne
™
and
BREW applications
• High-performance 184 MHz ARM926EJ-S
™
microprocessor core with memory
management unit (MMU)
• QDSP4000
™
high-performance digital signal
processors (DSP)
QUALCOMM [ QUALCOMM INCORPORATED ]
