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FM31278_11 参数 Datasheet PDF下载

FM31278_11图片预览
型号: FM31278_11
PDF下载: 下载PDF文件 查看货源
内容描述: 5V集成处理器伴侣与记忆 [5V Integrated Processor Companion with Memory]
分类和应用:
文件页数/大小: 26 页 / 459 K
品牌: RAMTRON [ RAMTRON INTERNATIONAL CORPORATION ]
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FM31278/276/274/272 - 5V I2C Companion  
512 Hz  
W
/OSCEN  
Oscillator  
32.768 kHz  
Clock  
Divider  
Update  
Logic  
1 Hz  
Date  
6 bits  
Years  
8 bits  
Months  
5 bits  
CF  
Hours  
6 bits  
Minutes  
7 bits  
Seconds  
7 bits  
Days  
3 bits  
R
User Interface Registers  
Figure 9. Real-Time Clock Core Block Diagram  
the oscillator to the X1 pin. Its high and low voltage  
levels can be driven rail-to-rail or amplitudes as low  
as approximately 500mV p-p. To ensure proper  
operation, a DC bias must be applied to the X2 pin.  
It should be centered between the high and low levels  
on the X1 pin. This can be accomplished with a  
voltage divider.  
Calibration  
When the CAL bit in a register 00h is set to 1, the  
clock enters calibration mode. In calibration mode,  
the CAL/PFO output pin is dedicated to the  
calibration function and the power fail output is  
temporarily unavailable. Calibration operates by  
applying a digital correction to the counter based on  
the frequency error. In this mode, the CAL/PFO pin  
is driven with a 512 Hz (nominal) square wave. Any  
measured deviation from 512 Hz translates into a  
timekeeping error. The user converts the measured  
error in ppm and writes the appropriate correction  
value to the calibration register. The correction  
factors are listed in the table below. Positive ppm  
errors require a negative adjustment that removes  
pulses. Negative ppm errors require a positive  
correction that adds pulses. Positive ppm adjustments  
have the CALS (sign) bit set to 1, where as negative  
ppm adjustments have CALS = 0. After calibration,  
the clock will have a maximum error of 2.17 ppm  
or 0.09 minutes per month at the calibrated  
temperature.  
In the example, R1 and R2 are chosen such that the  
X2 voltage is centered around the X1 oscillator drive  
levels. If you wish to avoid the DC current, you may  
choose to drive X1 with an external clock and X2  
with an inverted clock using a CMOS inverter.  
FM3127x  
X1 X2  
Vdd  
R1  
R2  
Figure 10. External Oscillator  
Layout Requirements  
The calibration setting is stored in F-RAM so is not  
lost should the backup source fail. It is accessed with  
bits CAL.4-0 in register 01h. This value only can be  
written when the CAL bit is set to a 1. To exit the  
calibration mode, the user must clear the CAL bit to a  
0. When the CAL bit is 0, the CAL/PFO pin will  
revert to the power fail output function.  
The X1 and X2 crystal pins employ very high  
impedance circuits and the oscillator connected to  
these pins can be upset by noise or extra loading. To  
reduce RTC clock errors from signal switching noise,  
a guard ring must be placed around these pads and  
the guard ring grounded. SDA and SCL traces should  
be routed away from the X1/X2 pads. The X1 and X2  
trace lengths should be less than 5 mm. The use of a  
ground plane on the backside or inner board layer is  
preferred. See layout example. Red is the top layer,  
green is the bottom layer.  
Crystal Oscillator  
The crystal oscillator is designed to use a 12.5pF  
crystal without the need for external components,  
such as loading capacitors. The FM3127x device has  
built-in loading capacitors that match the crystal.  
If a 32.768kHz crystal is not used, an external  
oscillator may be connected to the FM3127x. Apply  
Rev. 2.1  
Sept. 2011  
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