2SK2554
Reverse Drain Current vs.
Source to Drain Voltage
200
Repetitive Avalanche Energy E
AR
(mJ)
Maximum Avalanche Energy vs.
Channel Temperature Derating
250
I
AP
= 50 A
V
DD
= 25 V
duty < 0.1 %
Rg > 50
Ω
Reverse Drain Current I
DR
(A)
160
10 V
120
5V
80
V
GS
= 0, –5 V
200
150
100
40
Pulse Test
0
0.4
0.8
1.2
1.6
2.0
50
0
25
50
75
100
125
150
Source to Drain Voltage
V
SD
(V)
Channel Temperature Tch (°C)
Normalized Transient Thermal Impedance vs. Pulse Width
Normalized Transient Thermal Impedance
γ
s (t)
3
Tc = 25°C
1
D=1
0.5
0.3
0.2
0.1
0.1
0.05
θch
– c(t) =
γs
(t) •
θch
– c
θh
– c = 0.83°C/W, Tc = 25°C
P
DM
PW
T
1m
10 m
100 m
1
10
D=
PW
T
0.03
0.02
1
lse
0.0
t pu
ho
1s
100
µ
0.01
10
µ
Pulse Width
PW (S)
Avalanche Test Circuit and Waveform
E
AR
=
V
DSS
1
• L • I
AP2
•
V
DSS
– V
DD
2
V
DS
Monitor
L
I
AP
Monitor
V
(BR)DSS
I
AP
V
DD
I
D
V
DS
Rg
Vin
15 V
D. U. T
50
Ω
0
V
DD
Rev.6.00 Sep 07, 2005 page 5 of 7
RENESAS [ RENESAS TECHNOLOGY CORP ]
