欢迎访问ic37.com |
会员登录 免费注册
发布采购

RF2189PCBA 参数 Datasheet PDF下载

RF2189PCBA图片预览
型号: RF2189PCBA
PDF下载: 下载PDF文件 查看货源
内容描述: 3V , 2.5GHZ线性功率放大器 [3V, 2.5GHZ LINEAR POWER AMPLIFIER]
分类和应用: 放大器功率放大器
文件页数/大小: 6 页 / 105 K
品牌: RFMD [ RF MICRO DEVICES ]
 浏览型号RF2189PCBA的Datasheet PDF文件第1页浏览型号RF2189PCBA的Datasheet PDF文件第2页浏览型号RF2189PCBA的Datasheet PDF文件第4页浏览型号RF2189PCBA的Datasheet PDF文件第5页浏览型号RF2189PCBA的Datasheet PDF文件第6页  
Preliminary
Pin
1
2
3
4
5
6
7
8
Function
GND
GND
GND
NC
NC
RF IN
NC
PC
Description
Ground connection. Keep traces physically short and connect immedi-
ately to ground plane for best performance.
Same as pin 1.
Same as pin 1.
Not connected.
Not connected.
RF input. This input is DC coupled, so an external blocking capacitor is
required if this pin is connected to a DC path.
Not connected.
Power control pin. For maximum power this pin should be 3.3V. A
higher voltage is not recommended. For less output power and reduced
idle current this voltage may be reduced.
PC
RF2189
Interface Schematic
2
POWER AMPLIFIERS
See pin 1.
VCC1
500Ω
To RF
Stages
9
10
11
GND
NC
RF OUT
Ground connection. Keep traces physically short and connect immedi-
ately to ground plane for best performance.
Not internally connected.
RF output and bias for the output stage. The power supply for the out-
put transistor needs to be supplied to this pin. This can be done
through a quarter-wave length microstrip line that is RF grounded at the
other end, or through an RF inductor that supports the required DC cur-
rents.
Same as pin 11.
Not connected.
Power supply pin for the bias circuits. External low frequency bypass
capacitors should be connected if no other low frequency decoupling is
nearby.
Bias supply pin for the first stage. A small tuning capacitor is required to
set the desired frequency response. External low frequency bypass
capacitors should be connected as shown in the application schematic
if no other low frequency decoupling is nearby.
See pin 5.
See pin 11.
RF OUT
12
13
14
15
RF OUT
NC
VCC1
VCC2
VCC2
RF IN
BIAS
16
Pkg
Base
VCC2
GND
Connected internally to pin 15.
Ground connection. The backside of the package should be connected
to the ground plane through a short path, i.e., vias under the device
may be required.
See pin 15.
See pin 1 and 6.
Rev A4 010424
2-251