RT9701B
Preliminary
If the package is with dual VOUT or VIN pins, short both the same function pins as Figure 1 or Figure 2 to reduce the
internal turn-on resistance. If the output power will be delivered to two individual ports, it is specially necessary to
short both VOUT pin at the switch output side in order to protect the switch when each port are plug-in separately.
Under normal operating conditions, the package can dissipate the channel heat away. Wide power-bus planes connected
to VIN and VOUT and a ground plane in contact with the device will help dissipate additional heat.
V
IN
C
IN
1uF
RT9701BCBL
VIN
VOUT
VIN
GND
C
OUT
VOUT
V
OUT1
V
OUT2
C
OUT
CIN = 1uF, COUT = 470uF (Low ESR) on M/B
CIN = 1uF, COUT = 330uF (Low ESR) on Notebook
CIN = 10uF, COUT = 1uF on USB device
Figure 1. High Side Power Switch
V
IN
C
IN
RT9701BCB
VIN
VOUT
EN
GND
VOUT
V
OUT1
C
OUT
V
OUT2
C
OUT
Chip Enable
Figure 2. High Side Power Switch with Chip Enable Control
www.richtek.com
10
DS9701B-04 March 2007
RICHTEK [ RICHTEK TECHNOLOGY CORPORATION ]
