Thermoelectric Cooling Solutions
Performance Parameters
ΔT
max
K
Q
max
W
I
max
A
U
max
V
AC R
Ohm
H
mm
1MD03-012-XX
Type
1MD03-012-xx (N=12)
1MD03-012-04
1MD03-012-05
1MD03-012-08
71
72
73
0.95
0.77
0.49
1.1
0.8
0.5
1.5
1.07
1.34
2.12
0.9
1.1
1.4
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (T
melt
=230°C)
2. Solder AuSn (T
melt
=280°C)
B. Ceramics:
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, T
melt
=117°C)
3.2 Solder 138 (Sn-Bi, T
melt
= 138°C)
3.3 Solder 143 (In-Ag, T
melt
= 143°C)
3.4 Solder 157 (In, T
melt
= 157°C)
3.5 Solder 183 (Pb-Sn, T
melt
=183°C)
3.6 Optional (specified by Customer)
46 Warshavskoe shosse. Moscow 115230
Russia,
ph: +7-499-678-2082, fax: +7-499-678-2083, web:
www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
*
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
3.Aluminum Nitride (AlN)
* - used by default
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