Thermoelectric Module Datasheet
Performance Parameters
RMT Ltd
1MD03-004-XX
Type
ΔT
max
K
Q
max
W
I
max
A
U
max
V
AC R
Ohm
H
mm
1MD03-004-xx (N=4)
1MD03-004-04
1MD03-004-05
71
72
0.3
0.3
1.1
0.5
0.9
0.5
1.1
Performance specified at 300K, vacuum
0.4
0.9
Technical Drawing
Options available
A. TEC Assembly:
Solder SnSb (Tmelt=230°C)
B. Ceramics:
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
3.Aluminum Nitride (AlN)
100% Al
2
O
3
used be default
C. Ceramics Surface Options
D. Thermistor (optional)
1. Blank ceramics
Can be mounted to cold side
2. Metallized:
ceramics edge. Calibration
2.1 Ni / Sn(Bi)
is available.
2.2 Gold plating
3. Metallized and pre-tinned:
E. Terminal contacts
3.1 Solder 94 (PbSnBi, Tmelt=94°C)
1. Au plated WB pads
3.2 Solder 117 (In-Sn, Tmelt=117°C)
2. Au plated WB posts
3.3 Solder 138 (Sn-Bi, Tmelt=138°C)
3. Pre-tinned Copper wires
3.4 Solder 183 (Pb-Sn, Tmelt=183°C)
4. Insulated Wires
53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web:
Copyright 2010. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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