Thermoelectric Module Datasheet
Performance Parameters
Type
ΔT
max
Q
max
K
W
67
69
71
71
71
71
0.6
0.4
0.3
0.2
0.2
0.2
RMT Ltd
1MD04-004-XX
I
max
A
2.3
1.5
1.0
0.8
0.7
0.5
U
max
AC R H
V
Ohm mm
0.15
0.26
0.5
0.42
0.52
0.62
0.77
0.9
1.1
1.4
1.6
1.8
2.1
H2*
mm
1.4
1.6
1.9
2.1
2.3
2.6
h
mm
0.3
0.5
0.8
1.0
1.2
1.5
1MD04-004-xx (N=4)
1MD04-004-03
1MD04-004-05
1MD04-004-08
1MD04-004-10
1MD04-004-12
1MD04-004-15
Performance data are given at 300K, vacuum
*Optional H2 value is specified for 0.5mm ceramics thickness
Technical Drawing
Options available
C. Ceramics Surface Options
D. Thermistor (optional)
1. Blank ceramics
Can be mounted to cold side
2. Metallized:
ceramics edge. Calibration
2.1 Ni / Sn(Bi)
B. Ceramics:
is available.
2.2 Gold plating
1.Pure Al
2
O
3
(100%)
3. Metallized and pre-tinned:
2.Alumina (Al
2
O
3
- 96%)
E. Terminal wires
3.1 Solder 94 (PbSnBi, Tmelt=94°C)
3.Aluminum Nitride (AlN)
1. Pre-tinned Copper
3.2 Solder 117 (In-Sn, Tmelt=117°C)
2. Insulated Wires
3.3 Solder 138 (Sn-Bi, Tmelt=138°C)
100% Al
2
O
3
used as standard
3. Insulated Color Coded
3.4 Solder 183 (Pb-Sn, Tmelt=183°C)
4. Wire Bonding Pads
A. TEC Assembly:
Solder SnSb (Tmelt=230°C)
53 Leninskij prosp. Moscow 119991 Russia, ph: +7-499-132-6817, fax: +7-499-783-3664, web:
Copyright 2008. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
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