Thermoelectric Cooling Solutions
Performance Parameters
Type
1MDL06-024-03AN05
1MDL06-024-05AN05
1MDL06-024-07AN05
1MDL06-024-09AN05
1MDL06-024-12AN05
1MDL06-024-15AN05
1MDL06-024-xxAN05
I
max
A
U
max
V
AC R
Ohm
0.43
0.69
0.95
1.21
1.61
2.00
ΔT
max
K
Q
max
W
H
mm
1.4
1.6
1.8
2.0
2.3
2.6
1MDL06-024-xxAN05 (N=24)
69
9.75
5.3
72
6.11
3.3
72
4.45
2.4
3.0
73
3.49
1.9
73
2.64
1.4
73
2.12
1.1
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (T
melt
=230°C)
2. Solder AuSn (T
melt
=280°C)
B. Ceramics:
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, T
melt
=117°C)
3.2 Solder 138 (Sn-Bi, T
melt
= 138°C)
3.3 Solder 143 (In-Ag, T
melt
= 143°C)
3.4 Solder 157 (In, T
melt
= 157°C)
3.5 Solder 183 (Pb-Sn, T
melt
=183°C)
3.6 Optional (specified by Customer)
46 Warshavskoe shosse. Moscow 115230
Russia,
ph: +7-499-678-2082, fax: +7-499-678-2083, web:
www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
*
3.Aluminum Nitride (AlN)
* - used by default
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