23-21UBGC 参数 Datasheet PDF下载

型号：	23-21UBGC
PDF下载：	下载PDF文件查看货源
内容描述：	反向套餐LED芯片 [Reverse Package Chip LED]
分类和应用：
文件页数/大小：	8 页 / 120 K
品牌：	ROITHNER [ Roithner LaserTechnik GmbH ]

MODEL NO:

23-21UBGC/TR8

Reverse Package Chip LED

Device Number

DSE-231-009 REV.

1.0

ECN

Page:

7/8

Soldering heat reliability ( DIP ) :

Please refer to the following figure :

Soldering Iron :

Basic spec is

5 sec when 260 .If temperature is higher, time should be shorter (+10

-1sec). Power dissipation of iron should be smaller than 15 W , and temperature should

be controllable. Surface temperature of the device should be under 230

Rework :

1. Customer must finish rework within 5 sec under 260 .

2. The head of iron can not touch copper foil.

3. Twin-head type is preferred.

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