Reliability Test Items and Conditions
No.
1
2
3
4
5
6
7
Item
Solder Heat
Temperature Cycle
Thermal Shock
High Temperature Storage
Low Temperature Storage
DC Operating Life
High Temperature⁄High Humidity
Judgment Criteria
Forward Voltage Vf
Reverse Current I
R
Luminous Intensity Flux
-40C
30 min
-40C
5 min
85C
-35C
I
F
700mA
Ta 60C R.H 90 .
Test Conditions
260±5C
25C
5 min
105C
30 min
105C
5 min
25C
5 min
Test time
5 sec
100cycle
20 cycle
1000 hrs
1000 hrs
1000 hrs
1000 hrs
Vf
max
Increase <1.2x
I
R max
Increase <2x
Iv Decay < 50%
Ac⁄Re
0⁄1
0⁄1
0⁄1
0⁄1
0⁄1
0⁄1
0⁄1
Note Measurement shall be taken after the tested samples have been returned to normal ambient conditions.
Soldering heat reliability DIP
Please refer to the following figure
Soldering heat 260
¢ J
Max.
5
¢
within 5 sec
245¡
Ó
J
¢ J
Preheat
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Tel.: +43-1-586 52 43 - 0, Fax.: +43-1-586 52 43 44
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ROITHNER [ Roithner LaserTechnik GmbH ]
