SPECIFICATIONS
TERMINATIONS
Specifications are typical at 25OC unless otherwise noted.
Specifications are subject to change without notice.
Designation Termination
SM1
SM2
SM3
SM4
SM5
Gold Plated (Lead Free)
Solder Plated
Solder Dipped
Solder Plated (Lead Free)
Solder Dipped (Lead Free)
Fundamental Frequency
Motional Resistance R1 (
10 MHz 32 MHz 155.52 MHz
Ω)
30
5.5
100
2.2
25
6.2
30
15
4.0
30
Motional Capacitance C1 (fF)
Quality Factor Q (k)
Shunt Capacitance C0 (pF)
2.3
2.3
Max Process Temperature 260OC for 20 sec.
Calibration Tolerance1
Load Capacitance2
+_ 100 ppm, or tighter as required
20 pF for f ≤ 50 MHz
SUGGESTED LAND PATTERN
10 pF for f > 50 MHz
0.070 (1.78)
Drive Level
500
µ
µ
W MAX for f ≤ 50 MHz
200
W MAX for f > 50 MHz
+
+
_
Frequency-Temperature
Stability1,3
_ 50 ppm to 10 ppm (Commercial)
0.160 (4.06)
+
+
_
_ 100 ppm to 20 ppm (Industrial)
+
+
_
_ 100 ppm to 30 ppm (Military)
Aging, first year4
10 ppm MAX
inches (mm)
0.270 (6.86)
Shock, survival5
10,000 g, 0.2 ms, 1/2 sine
50 g, 10-2,000 Hz swept sine
Vibration, survival6
EQUIVALENT CIRCUIT
Operating Temp. Range
-10OC to +70OC (Commercial)
-40OC to +85OC (Industrial)
-55OC to +125OC (Military)
C0
-55OC to +125OC.
1
L1
C1
R1
2
Storage Temp. Range
Max Process Temperature 260OC for 20 sec.
R1 Motional Resistance L1 Motional Inductance
C1 Motional Capacitance C0 Shunt Capacitance
1. Other tolerances available. Contact factory.
2. Unless specified otherwise.
3. Does not include calibration tolerance. The characteristics of the frequency stability over
temperature follow that of the AT thickness-shear mode.
4. 10 ppm MAX for frequencies below 40 MHz. For tighter tolerances and higher
frequencies contact factory.
PACKAGING OPTIONS
5. Up to 100,000 g. Contact factory.
6. Per MIL-STD-202G, Method 204D, Condition E. Random vibration testing also available.
• Tray Pack
• 16mm tape, 7” or 13” reels
Per EIA 481 (see Tape and Reel data sheet 10109)
HOW TO ORDER CX1HGSM AT CRYSTALS
CX1
S
HG
C
SM1 – 32.0M , 100
/
100
/
—
/
I
O.T. = 3RD O.T. Mode
Blank = Fundamental
Mode
C = Ceramic Lid
Blank = Glass Lid
Operating Temp. Range:
Frequency
Stability over
Temp. Range
(in ppm)
Calibration
“S” if special or
custom design.
Blank if Std.
Frequency
M = MHz
C
= -10OC to +70OC
Tolerance
@ 25OC
(in ppm)
I = -40OC to +85OC
M = -55OC to +125OC
SM1 = Gold Plated (Lead Free)
SM2 = Solder Plated
SM3 = Solder Dipped
SM4 = Solder Plated (Lead Free)
SM5 = Solder Dipped (Lead Free)
S
= Customer Specified
OR
200
I
—
—
Total
Operating Temp. Range:
C
= -10OC to +70OC
Frequency
Tolerance
(in ppm)
I = -40OC to +85OC
M = -55OC to +125OC
S
= Customer Specified
10108 - Rev B
E
RSG Electronic Components GmbH - Sprendlinger Landstr. 115 - 63069 Offenbach - Germany - www.rsg-electronic.de
Pb
RSG [ RSG ELECTRONIC COMPONENTS GMBH ]
