Transient Voltage Suppressors - 20KPA Series
Soldering Parameters
Feflow Condition
- Temperature Min (T s(min))
Pre Heat
- Temperature Max (T s(min))
- Time (min to max) (t s)
Average ramp up rate (Liquidus Temp (TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
Peak Temperature (T P)
Time within 5°C of actual peak Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
- Temperature (T L) (Liquidus)
- Time (min to max) (t s)
Lead-free assembly
150°C
200°C
60-180 secs
3°C/second max
3°C/second max
217°C
60-150 seconds
260+0/-5 °C
20-40 seconds
6°C/second max
8 minutes Max.
280°C
T
P
Ramp-up
t
p
one
Critical Z
P
T
L
to T
Physical Specifications
Weight
Case
Polarity
Termina
0.045oz., 1.2g
JEDEC DO-201 molded plastic body over
passivated junction.
Color band denotes the cathode except Bipolar.
Matte Tin axial leads, solderable per
JESD22-B102D.
t
L
T
L
Temperature (T)
T
s(max)
Ramp-down
T
s(min)
Preheat
t
s
Time (t)
Environmental Specifications
Temperature Cycle
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Pressure Cooker
265°C
10 seconds
1 time
High Temp. Storage
HTRB
Thermal Shock
Flow/Wave Soldering
Peak Temperature :
Dipping Time :
Soldering :
Circuit Protection
System
Specifications are subject to change without notice.
Please refer to
http://www.ruilon.com
for current information.
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RUILON [ Ruilongyuan Electronics Co.,Ltd ]
