K4M56163PG - R(B)E/G/C/F
4M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA
FEATURES
• 1.8V power supply.
• LVCMOS compatible with multiplexed address.
• Four banks operation.
• MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
• EMRS cycle with address key programs.
• All inputs are sampled at the positive going edge of the system
clock.
• Burst read single-bit write operation.
• Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
-. DS (Driver Strength)
-. DPD (Deep Power Down)
• DQM for masking.
• Auto refresh.
•
•
•
•
64ms refresh period (8K cycle)
Commercial Temperature Operation (-25°C ~ 70°C).
Extended Temperature Operation (-25°C ~ 85°C).
54Balls FBGA ( -RXXX -Pb, -BXXX -Pb Free).
Mobile SDRAM
GENERAL DESCRIPTION
The K4M56163PG is 268,435,456 bits synchronous high data
rate Dynamic RAM organized as 4 x 4,196,304 words by 16 bits,
fabricated with SAMSUNG’s high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
ORDERING INFORMATION
Part No.
K4M56163PG-R(B)E/G/C/F75
K4M56163PG-R(B)E/G/C/F90
K4M56163PG-R(B)E/G/C/F1L
Max Freq.
133MHz(CL3), 83MHz(CL2)
111MHz(CL3), 83MHz(CL2)
111MHz(CL3)
*1
, 66MHz(CL2)
LVCMOS
54 FBGA Pb
(Pb Free)
Interface
Package
- R(B)E/G : Normal/ Low Power, Extended Temperature(-25°C ~ 85°C)
- R(B)C/F : Normal/ Low Power, Commercial Temperature(-25°C ~ 70°C)
Notes :
1. In case of 40MHz Frequency, CL1 can be supported.
Address configuration
Organization
16M x 16
Bank
BA0, BA1
Row
A0 - A12
Column Address
A0 - A8
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NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PRO-
VIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure could
result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or pro-
visions may apply.
February 2006
SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
