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K7D803671B-HC25 参数 Datasheet PDF下载

K7D803671B-HC25图片预览
型号: K7D803671B-HC25
PDF下载: 下载PDF文件 查看货源
内容描述: 256Kx36 & 512Kx18 SRAM [256Kx36 & 512Kx18 SRAM]
分类和应用: 存储内存集成电路静态存储器双倍数据速率时钟
文件页数/大小: 16 页 / 269 K
品牌: SAMSUNG [ SAMSUNG SEMICONDUCTOR ]
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K7D803671B
K7D801871B
Document Title
8M DDR SYNCHRONOUS SRAM
256Kx36 & 512Kx18 SRAM
Revision History
Rev No.
Rev. 0.0
Rev. 0.1
Rev. 0.2
History
-Initial document.
-ZQ tolerance changed from 10% to 15%
-Stop Clock Standby Current condition changed from
V
IN
=V
DD
-0.2V or 0.2V fixed to V
IN
=V
IH
or V
IH
-V
DDQ
Max. changed to 2.0V
SA0, SA1 defined for Boundary Scan Order
-Deleted -HC16 part(Part Number, Idd, AC Characterisctics)
- Absolute Maximum ratings V
DDQ
changed from 3.13V to 2.825V
- LBO input level changed from High/Low to V
DDQ
/V
SS
- Stop Clock Standby Current condition changed
from K=Low, K=High to K=Low, K=Low
- t
CHQV/
t
CLQV
changed from 0.1ns to 0.2ns for -33 part
from 0.1ns to 0.2ns for -30 part
from 0.1ns to 0.25ns for -25part
- t
CHQX/
t
CLQX
changed from -0.3ns to -0.2ns for -33 part
from -0.3ns to -0.2ns for -30 part
from -0.4ns to -0.25ns for -25part
-
t
CHQZ/
t
CLQZ
changed from 0.1ns to 0.2ns for -33 part
from 0.1ns to 0.2ns for -30 part
from 0.1ns to 0.25ns for -25part
-
t
KXCH
changed from 1.8ns to 1.7ns for -33 part
-
t
KXCL
changed from 1.8ns to 1.7ns for -33 part
- Clarification on the features and the timing waveforms regarding the
burst controllability.
- Recommended DC operating conditions for Clock added.
- AC test conditions for V
DDQ
=1.8V and Single ended clock added.
(AC Test Conditions 2)
- Package thermal characteristics added.
- Add-HC35 part(Part Number, Idd, AC Characteristics)
- Absolute Maximum Rating VDDQ changed from 2.825V to 2.4V
- V
CM-CLK
Min changed from 0.6V to 0.68V
- Add-HC37 part(Part Number, Idd, AC Characteristics)
Draft Data
July. 2000
Aug. 2000
Oct. 2000
Remark
Advance
Advance
Advance
Rev. 0.3
Nov. 2000
Advance
Rev. 0.5
Rev. 0.6
Rev. 0.7
Jan. 2001
Feb. 2001
Mar. 2001
Prelimary
Prelimary
Prelimary
Rev. 1.0
May. 2001
Final
Rev. 2.0
Rev. 3.0
Sep. 2001
Jan. 2002
Final
Final
Rev. 4.0
Jan. 2002
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the
right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters
of this device. If you have any questions, please contact the SAMSUNG branch office near your office, call or cortact Headquarters.
-1-
January. 2002
Rev 4.0