DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Operating
temperature range
Storage
temperature range
Requirements
- 55
℃
~ + 125
℃
40
℃
max., 70% RH max.
Test Conditions
-
at packing condition
Preheat temperature : 100 ~ 150
℃
Preheat time : 60 sec.
Solder temperature : 245
±
5
℃
Soldering time : 10
±
1 sec.
Solderability
More than 90% of the terminal electrode shall be
covered with new solder
CHIP BEAD, Reliability & Test Condition
Resistance to
soldering heat
1. No damage such as cracks should be
caused in chip element
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than
±30
%
More than 50% of the terminal electrode
shall be covered with new solder
Preheat temperature : 100 ~ 150
℃
Preheat time : 60 sec.
Solder temperature : 270
±
10
℃
Soldering time : 10
±
0.5 sec.
Reflow soldering
ST
≥
ST
1
CT
2
CT
Preheat temperature : 150
℃
Preheat time : 60 sec.
Solder temperature : 245
±
5
℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
High temperature
resistance
Temperature : 125
±
3
℃
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 125
±
3
℃
Applied current : rated current
Time : 1000
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 40
±
2
℃
Humidity : 90
±
2 % RH
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
High temperature
load resistance
1. No mechanical damage
2. Impedance shall not change more than
±30
%
Humidity
resistance
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
SAMWHA [ SAMWHA ELECTRIC ]
