DPS-081104
CHIP BEADS
Reliability & Test Condition
Item
Operating
Requirements
Test Conditions
- 55 ℃ ~ + 125 ℃
-
temperature range
Storage
40 ℃ max., 70% RH max.
at packing condition
temperature range
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
More than 90% of the terminal electrode shall be
covered with new solder
Solderability
Solder temperature : 245 ± 5 ℃
Soldering time : 10 ± 1 sec.
1. No damage such as cracks should be
caused in chip element
Preheat temperature : 100 ~ 150 ℃
Preheat time : 60 sec.
2. More than 75% of the terminal electrode
shall be covered with new solder
3. Impedance shall not change
more than ±30 %
Resistance to
soldering heat
Solder temperature : 270 ± 10 ℃
Soldering time : 10 ± 0.5 sec.
More than 50% of the terminal electrode
shall be covered with new solder
Preheat temperature : 150 ℃
Preheat time : 60 sec.
1
ST ≥
CT
Solder temperature : 245 ± 5 ℃
Soldering time : 10 sec. max.
(Reflow soldering profile)
Reflow soldering
2
CT
ST
Temperature : 125 ± 3 ℃
Time : 500 ± 12 hours
High temperature
resistance
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 125 ± 3 ℃
Applied current : rated current
Time : 1000 ± 12 hours
High temperature
load resistance
1. No mechanical damage
2. Impedance shall not change more than ±30 %
Measurement at room ambient
temperature after placing for 24 hours
Temperature : 40 ± 2 ℃
Humidity : 90 ± 2 % RH
Humidity
resistance
Time : 500 ± 12 hours
Measurement at room ambient
temperature after placing for 24 hours
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
SAMWHA [ SAMWHA ELECTRIC ]
