DPS-081104
CHIP BEADS ARRAY
Reliability & Test Condition
Item
Requirements
Test Conditions
Temperature : 40
±
2
℃
Humidity : 90
±
2 % RH
Applied current : rated current
Time : 500
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
Temperature : -55
±
3
℃
Time : 1000
±
12 hours
Measurement at room ambient
temperature after placing for 24 hours
1. -55
±
3℃ for 30 minutes
2.125
±
3
℃
for 30 minutes
3. repeat 100 cycle
Frequency : 10 ~ 55 Hz
Amplitude : 1.5 mm
Direction : X, Y, Z
Sweep time : 2 hours for each axis
Drop 10 times on a concrete floor
from a height of 100 cm
No mechanical damage
ITEM
Flexure strength
A (mm)
B (mm)
C (mm)
W (kgf)
4 ARRAY
Humidity load
resistance
Low temperature
resistance
1. No mechanical damage
2. Impedance shall not change more than
±30
%
Thermal shock
CHIP BEAD, Reliability & Test Condition
Vibration
Drop
R0.5
Land pattern
B C
A
D
0.8
0.8
3.0
0.4
W
50
20
W
Bending strength
The terminal electrode shall be neither break off
nor the chip damage
R340
2 mm
Resistance meter
This description in the this catalogue is subject to change without notice
http://www.samwha.com/chip
SAMWHA ELECTRONICS CO., LTD
SAMWHA [ SAMWHA ELECTRIC ]
