qSI-3000KM
Series
sReference
Data
Copper Foil Area-Thermal Resistance
Glass-epoxy substrate : 30×30mm
100
90
θ
j-a (°C/W)
80
70
60
50
40
10
100
Copper Foil Area (mm
2
)
1000
Copper Foil Area-Power Dissipation
Glass-epoxy substrate : 30×30mm
1.5
Power Dissipation P
D
(W)
Ta=25°C
1
40°C
60°C
0.5
85°C
0
10
100
Copper Foil Area (mm
2
)
1000
• Obtaining Junction Temperature
Temperature of lead part of GND terminal: Measure T
C
with thermocouple. Substitute value to the following for-
mula to obtain the junction temperature
Case temperature
measurement point
T
j
=P
D
× θ
j–C
+ T
C
(
θ
j–C
= 6
°
C/W)
sExample
of Soldering Pattern Design
(Unit : mm)
6.0
6.1
2.4
5.88
2.5
1.27
0.47
0.8
7