Non resettable fuses
SMD-SPT
Surface Mount Fuse, 5 x 20 mm, Time-Lag T, H, 250 VAC, Au plating
IEC 60127-2 · 250 VAC · 300 VDC · Time-Lag T
Description
- Directly solderable on printed circuit boards
- IEC Standard Fuse
- H = High Breaking Capacity
Applications
References
Weblinks
- Primary Protection on SMD PCB
Standards
- IEC 60127-2/5
- UL 248-14
- CSA C22.2 no. 248.14
Approvals
- VDE Certificate Number: 40010881
- UL File Number: E41599
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC, 300 VDC
1 - 16 A
500 A - 1500 A
Time-Lag T
PCB,SMT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Ceramic
Gold-Plated Copper Alloy
1 g
0 °C to 60 °C, max. 70% r.h.
, Current, Voltage, Characteristic,
Breaking Capacity
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Moisture Resistance Test
Terminal Strength
Thermal Shock
Reflow
245 °C / 3 sec acc. to IEC 60068-2-58,
Test Td
260 °C / 10 sec acc. to IEC 60068-2-58,
Test Td
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
Deflection of board 1 mm for 1 minute
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 215A
Case Resistance
Resistance to Solvents
Dimensions
20 mm
10
±0.2
+0.1
-0.2
ø 5.2
5
5.5
20
±0.5
Soldering pads
9.5
5.5
Fuses
SCHURTER [ SCHURTER INC. ]
