Non resettable fuses
MSF 250
Subminiature Fuse, 8.5 mm, Quick-Acting F, 250 VAC, 250 VDC
IEC 60127-3 · 250 VAC · Quick-Acting F
Description
Standards
- Directly solderable on printed circuit boards
- Low Breaking Capacity
- IEC 60127-3/3
- UL 248-14
- CSA C22.2 no. 248.14
Corresponding Fuseholder FMS (250V)
Fuse Kit Fuse Kit Microfuse
References
Weblinks
Approvals
- VDE License Number: 101035
- UL File Number: E41599
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.04 - 5 A
35 A
Quick-Acting F
PCB,THT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Thermoplastic, UL 94V-0
Tin-Plated Copper
0.5 g
0 °C to 60 °C, max. 70% r.h.
, Type, Current, Voltage, Characteri-
stic, Approvals
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Current Carrying Capacity
Life Test
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Thermal Shock
Wave, Iron
235 °C / 2 sec acc. to IEC 60068-2-20,
Test Ta, method 1
260 °C / 5 sec acc. to IEC 60068-2-20,
Test Tb, method 1A
acc. to IEC 60068-2-6, test Fc
acc. to EIA/IS-722, Test 4.3.3
MIL-STD-202, Method 108A
(1000h @ 0.42*In @ 70°C)
MIL-STD-202, Method 103B
(1000h @ 0.1*In @ 0.85 r.H. @ 85°C)
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
MIL-STD-202, Method 107D
(200 air-to-air cycles from -55 to
+125°C)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 213B
(Shock 50gn, half sine wave, 11 ms)
MIL-STD-202, Method 215A
min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12)
Case Resistance
Mechanical Shock
Resistance to Solvents
Flammability
Fuses
SCHURTER [ SCHURTER INC. ]
