Non resettable fuses
MXT 250
Subminiature Fuse, 8.5 mm, Time-Lag T, 250 VAC, 100 A
IEC 60127-3 · 250 VAC · Time-Lag T
Description
Standards
- Directly solderable on printed circuit boards
- High Breaking Capacity
- IEC 60127-3/4
- UL 248-14
- CSA C22.2 no. 248.14
Applications
- Primary Protection on PCB
- Power Supply Adapter for e.g. laptops
- SMPS (Switching Mode Power Supply) for TV's and DVD's
Corresponding Fuseholder FMS (250V)
References
Approvals
- VDE License Number: 40008838
- UL File Number: E41599
Weblinks
Technical Data
Rated Voltage
Rated Current
Breaking Capacity
Characteristic
Mounting
Admissible Ambient Air Temp.
Climatic Category
Material: Housing
Material: Terminals
Unit Weight
Storage Conditions
Product Marking
250 VAC
0.8 - 10 A
100 A
Time-Lag T
PCB,THT
-55 °C to 125 °C
55/125/21 acc. to IEC 60068-1
Thermoplastic, UL 94V-0
Tin-Plated Copper
0.78 g
0 °C to 60 °C, max. 70% r.h.
, Type, Current, Voltage, Characteri-
stic, Approvals
Soldering Methods
Solderability
Resistance to Soldering Heat
Resistance to Vibration
Life Test
Load Humidity Test
Moisture Resistance Test
Terminal Strength
Case Resistance
Mechanical Shock
Resistance to Solvents
Flammability
Wave, Iron
235 °C / 2 sec acc. to IEC 60068-2-20,
Test Ta, method 1
260 °C / 5 sec acc. to IEC 60068-2-20,
Test Tb, method 1A
acc. to IEC 60068-2-6, test Fc
MIL-STD-202, Method 108A
(1000h @ 0.42*In @ 70°C)
MIL-STD-202, Method 103B
(1000h @ 0.1*In @ 0.85 r.H. @ 85°C)
MIL-STD-202, Method 106E
(50 cycles in a temp./mister chamber)
MIL-STD-202, Method 211A
(Deflection of board 1 mm for 1 minute)
acc. to EIA/IS-722, Test 4.7
>100 MΩ (between leeds and body)
MIL-STD-202, Method 213B
(Shock 50gn, half sine wave, 11 ms)
MIL-STD-202, Method 215A
min. UL 94V-1
(acc. to EIA/IS-722, Test 4.12)
Dimensions
ø 8.5
8.5 mm
ø 8.5
8.5
8.5
0.5
0.5
1
+0.1
0
3.2
18.8
4.3
5.08
ø 0.64
5.08
3.2
ø 0.64
5.08
Drilling diagram
Fuses
SCHURTER [ SCHURTER INC. ]
