SMK35A16-3
Features
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SETMEKRON
Glass Passivated Three Phase Bridge Rectifier
Ideal for printed circuit board
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
2500V Isolation ratings
High temperature soldering
：
260℃/10 seconds at terminals
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Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Date
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Major Ratings and Characteristics
I
F(AV)
RRM
Case:
SIP2-5 (RS-C3) Molded plastic over
glass passivated chip
Terminals:
Solder plated, solderable
per J-STD-002 and JESD22-B102D
Polarity:
Polarity symbols marked on body
V
I
●
FSM
I
R
V
T
F
j max.
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35A
1600V
500 A
5μA
1.1V
150℃
Maximum Ratings & Thermal Characteristics
(TA = 25 °C unless otherwise noted)
Items
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
at T
c
=80℃ (With heatsink)
Peak forward surge current 8.3 ms single half sine-
wave superimposed on rated load (JEDEC Method)
Thermal resistance junction to case per leg
(1)
Isolation Breakdown Voltage(R.M.S)
@a.c.50HZ;r.m.s.;1min
I
2
t Rating for Fusing (t<8.3ms)
Operating junction and storage temperature range
Symbol
V
V
V
RRM
RMS
DC
SMK15A16
1600
1120
1600
15
SMK25A16
1600
1120
1600
25
SMK35A16
1600
1120
1600
35
UNIT
V
V
V
A
I
I
F(AV)
FSM
θJC
500
0.96
2500
1000
STG
A
℃/W
V
A
2
s
℃
R
V
isol
I
2
t
T
J
,
T
–55 to +150
Note 1: With heatsink, Thermal resistance test is according to JESD 282b.
Electrical Characteristics for Rectifier
Items
Instantaneous forward voltage
per leg
Reverse current per leg
(T
A
= 25 °C unless otherwise noted)
Test conditions
I
F
=25A
(2)
Symbol
V
Min
-
Type
1.00
Max
1.30
10
500
UNIT
V
F
V =V
R
DC
T
j
=25℃
℃
T
j
=125
I
R
-
-
μA
Note2: Pulse test:300μs pulse width,1% duty crcle.
SEMIKRON [ SEMIKRON INTERNATIONAL ]
