ESD/EMI Protection
for Color LCD Interfaces
PROTECTION PRODUCTS - EMIClamp
TM
Description
The EClamp
TM
2394P is a (L-C) low pass filter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. This state-of-the-art device utilizes solid-
state silicon-avalanche technology for superior clamp-
ing performance and DC electrical characteristics.
They have been optimized for protection of color
LCD and camera lines in cellular phones and other
portable electronics.
The device consists of four identical circuits comprised
of TVS diodes for ESD protection, and a 5-pole induc-
tor - capacitor network for EMI/RFI filtering. A typical
inductor value of 19nH and a capacitor value of 12pF
are used to achieve 30dB minimum attenuation from
800MHz to 2.7GHz. The TVS diodes provide effective
suppression of ESD voltages in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC
61000-4-2, level 4.
The EClamp2394P is in a 8-pin, RoHS/WEEE compli-
ant, SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPd. The small pack-
age makes it ideal for use in portable electronics such
as cell phones, digital still cameras, and PDAs.
EClamp2394P
PRELIMINARY
Features
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to
IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
Filter performance: 30dB minimum attenuation
800MHz to 2.7GHz
TVS working voltage: 5V
Inductor: 19nH (Typical)
Capacitors: 12pF (Typical at VR = 2.5V)
Protection and filtering for four lines
Solid-state technology
Mechanical Characteristics
SLP2116P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPd
Marking: Marking Code
Packaging: Tape and Reel per EIA 481
Applications
Color LCD Protection
Cell Phone CCD Camera Lines
Clamshell Cell Phones
Circuit Diagram (Each Line)
Package Configuration
2.10
1 2
L1
L2
IN
C1
C2
C3
OUT
1.60
0.50 BSC
GND
0.58
Device Schematic (4X)
Revision 2/23/2006
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
1
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