RClamp2402B
PROTECTION PRODUCTS
Applications Information
Device Connection Options
This device is optimized for protection of 1 line
operating in excess of 3GHz. It may also be used to
protect two lines operating in excess of 2.0GHz. The
device is connected as follows:
Protection for one line with <1pF capacitance can be
achieved by connecting one data line to either pin 1 or
pin 2 with the other pin connected to ground. Pin 3 is
not connected. The connection to ground should be
made directly to a ground plane. The path length
should also be kept as short as possible to minimize
parasitic inductance.
Protection of two lines is achieved by connecting data
lines at pins 1 & 2. Pin 3 is connected to ground. The
connection to ground should be made directly to a
ground plane. The path length should also be kept as
short as possible to minimize parasitic inductance.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Figure 1. Pin Configuration
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2006 Semtech Corp.
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