Low Capacitance TVS
for Ethernet and Telecom Interfaces
PROTECTION PRODUCTS - TransClamp
ΤΜ
Description
A TransClamp
ΤΜ
is a low capacitance TVS array designed
to protect high speed data interfaces. This series has
been specifically designed to protect sensitive compo-
nents which are connected to data and transmission
lines from overvoltage caused by
ESD
(electrostatic
discharge),
CDE
(Cable Discharge Events), and
Light-
ning.
These devices integrate low capacitance, surge-rated
compensation diodes with a high power transient
voltage suppressor (TVS). The compensation diodes
are arranged in a bridge pattern allowing the device to
be connected in common mode and/or differential
mode. This allows the designer maximum flexibility and
reduces parts count. The capacitance of the device is
limited to 12pF maximum from line-to-line to ensure
correct signal transmission on high-speed lines.
These devices may be used to meet Telcordia GR-1089-
CORE short-haul (intra-building) surge requirements and
will withstand a minimum 100 A surge for a 2/10µs
pulse.
The TClamp
TM
3302N is in a 10-pin, RoHS/WEEE compli-
ant, SLP2626P10 package. It measures 2.6 x 2.6 x
0.60mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. They are
particularly well suited for applications where board
space is at a premium such as integrated connectors/
magnetics and carrier class Ethernet equipment.
TClamp3302N
Features
Transient protection for high-speed data lines to
Bellcore 1089 (Intra-Building) 100A (2/10µs)
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
IEC 61000-4-5 (Lightning) L5, 95A (8/20µs)
Low capacitance (12pF line-to-line)
Low operating voltages
(3.3V)
Low clamping voltage
Small SLP Package saves board space
Solid-state technology
Mechanical Characteristics
SLP2626P10 10L package
RoHS/WEEE Compliant
Nominal Dimensions: 2.6 x 2.6 x 0.60 mm
Lead Pitch: 0.5mm
Molding compound flammability rating: UL 94V-0
Marking: Marking Code
Packaging: Tape and Reel
Applications
10/100/1000 Ethernet
T3/E3
Integrated Magnetics
Carrier Class Equipment
Customer Premise Equipment
Circuit Diagram
LINE 1
(1, 2, 3)
Package Configuration
2.60
1 2
C
L
C
2.60
L
Center Tab
0.50 BSC
LINE 2
(8, 9, 10)
0.60
10 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
Revision 01/17/2008
1
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