Reflow
T
sol
CRITERIA FOR JUDGING THE DAMAGE
Criteria for Judgment
Item
Forward Voltage
Luminous Intensity
Symbol
V
F
I
V
Condition
I
F
=20mA
I
F
=20mA
Note : [1] USL : Upper Standard Level
[2] LSL : Lower Standard Level
℃
260
< 10sec. Reflow
Soldering
Ω
□
Z-Power LED X10490
Z-Power LED X10490
Technical Data Sheet
5. Reliability Test
Number
of
Damaged
0/22
0/22
0/22
0/22
0/22
Item
Reference
EIAJ
ED-4701
EIAJ
ED-4701
EIAJ
ED-4701
EIAJ
ED-4701
Internal
Reference
Internal
Reference
Internal
Reference
Internal
Reference
MIL-STD-
883D
Test Conditions
T
a
=-40
o
C(30min) ~
100
o
C(30min)
T
a
=100
o
C
T
a
=60
o
C, RH=90%
T
a
=-40
o
C
T
a
=25
o
C,
I
F
=20mA
Duration /
Cycle
100 Cycle
1000 Hours
1000 Hours
1000 Hours
1000 Hours
Thermal Shock
High Temperature
Storage
High Temp. High
Humidity Storage
Low Temperature
Storage
Operating
Endurance Test
High Temperature
High Humidity Life
Test
High Temperature
Life Test
Low Temperature
Life Test
ESD(HBM)
T
a
=60
o
C, RH=90%,
I
F
=20mA
500 Hours
0/22
T
a
=85
o
C,
I
F
=20mA
T
a
=-40
o
C,
I
F
=20mA
1KV at 1.5k ; 100pF
500 Hours
1000 Hours
3 Time
3 Time
0/22
0/22
0/22
0/22
MIN
-
LSL
[2]
×
0.7
MAX
USL
[1]
×
1.2
-
Rev.06
September 2011
www.seoulsemicon.com
SSC- QP- 7- 07- 24 (Rev.00)
SEOUL [ Seoul Semiconductor ]
