Device Surface Temperature [ C]
Device Surface Temperature [ C]
o
Technical Data Sheet
5. Soldering profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
• Preliminary heating to be at 210℃ max. for 2 minutes max.
• Soldering heat to be at 240℃max. for 10 seconds max.
280
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105
120
135
150
165
180
195
o
Soldering Times [sec]
(2) Lead-Free Solder
• Preliminary heating to be at 220℃max. for 2 minutes max.
• Soldering heat to be at 260℃max. for 10 seconds max.
280
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105 120 135 150 165 180 195
Soldering Times [sec]
(3) Hand Soldering Condition
•
Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-FCW100Z
SSC
-
Revision 1.7
www.ZLED.com
서식번호 : SSC-QP-7-07-24 (Rev.0.0)
SEOUL [ Seoul Semiconductor ]
