6. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
o
o
2.5~5 C / sec.
240 C Max.
10 sec. Max.
Pre-heat
120~150℃
Pre-heating
120 sec.
Max.
o
60sec. Max.
120~150 C
2.5~5 C / sec.
o
Pre-heat time
Above 200 C
Peak-Temperature
240℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
o
Lead Free Solder
150~200℃
o
1~5 C / sec.
260 C Max.
10 sec. Max.
Pre-heat
Pre-heating
o
120 sec.
Max.
60sec. Max.
o
150~200
C
1~5 C / sec.
o
Pre-heat time
Above 220 C
Peak-Temperature
260℃ Max.
120sec. Max.
Soldering time
Condition
10 sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
SEOUL [ Seoul Semiconductor ]
