5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
°C
Operation heating
240
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
150
120
Pre-heating
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
°C
Operation heating
260
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
150
120
Pre-heating
0
60 to 120 sec.
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-YG101-IC1
SSC-QP-0401-06(REV.1)
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SEOUL [ Seoul Semiconductor ]
