Rev.
1.00
SWTS907
9. Soldering Profile
The LED can be soldered in place using the reflow soldering method.
(1)
Lead solder
Preliminary heating to be at maximum 210
°
C for maximum 2 minutes.
Soldering heat to be at maximum 240
°
C for maximum 10 seconds.
280
Device Surface Temperature [ C]
o
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105 120 135 150 165 180 195
Soldering Times [sec]
(2)
Lead-free solder
Preliminary heating to be at maximum 220
°
C for maximum 2 minutes.
Soldering heat to be at maximum 260
°
C for maximum 10 seconds.
280
Device Surface Temperature [ C]
o
240
200
160
120
80
40
0
0
15
30
45
60
75
90
105
120 135 150
165
180 195
Soldering Times [sec]
(3)
Hand Soldering conditions
Not more than 5 seconds @MAX 300
°
C, under Soldering iron.
SSC-QP
-7-03-44(
갑
)
10
SEOUL SEMICONDUCTOR CO., LTD.
SEOUL [ Seoul Semiconductor ]
