Rev. 1.00
SZAF0B
7. Reliability
(1) TEST ITEMS AND RESULTS
TEST ITEM
Life Test 1
Life Test 2
Thermal Shock
High Temperature Life Test
Low Temperature Life Test
High Temperature Storage
Low Temperature Storage
High Humidity Heat Life Test
*1
Humidity Heat Load
Resistance to Soldering Heat
Solder ability
(Reflow Soldering)
Temperature Cycle
Moisture Resistance Cycle
Test conditions
Note
1000
hrs.
500 hr
20
cycle
1000
hrs.
1000
hrs.
1000
hrs.
1000
hrs.
500
hrs.
1000
hrs.
2
times
1
time
over
95%
100
cycle
10
cycle
Number of
Damaged
0/20
0/20
0/50
0/20
0/20
0/50
0/50
0/20
0/50
0/50
0/50
0/50
0/50
Reference
EIAJ ED-4701
100 101
EIAJ ED-4701
100 101
EIAJ ED-4701
300 307
-
-
EIAJ ED-4701
200 201
EIAJ ED-4701
200 202
EIAJ ED-4701
100 102
EIAJ ED-4701
100 103
EIAJ ED-4701
301 302
EIAJ ED-4701
303
EIAJ ED-4701
100 105
EIAJ ED-4701
200 203
T
a
=
25
°
C;
I
F
=
20
mA
T
a
=
25
°
C;
I
F
=
30
mA
-30
°
C
~ 85
°
C
(30
min)
(30
min)
T
a
=
85
°
C;
I
F
=
5
mA
T
a
=
- 30
°
C;
I
F
=
20
mA
T
a
=
100
°
C
T
a
=
- 40
°
C
T
a
=
60
°
C;
RH
=
90%,
I
F
=
20
mA
T
a
=
60
°
C;
RH
=
90%
T
sld
=
260
°
C,
10
sec
Pre treatment; 30
°
C,
70%, 168
hr
T
sld
=
215±5
°
C,
3
sec
(Lead Solder)
(30
min)
- 40
°
C
~ 25
°
C
~ 100
°
C
~ 25
°
C
(5
min)
(30
min)
(5
min)
25
°
C
~ 65
°
C
~ - 10
°
C
RH
=
90%, 24
hr
/ 1
cycle
(2) CRITERIA FOR JUDGING THE DAMAGE
Item
Symbol
Test Condition
Criteria for Judgment
Min.
Forward Voltage
Reverse Current
Luminous Intensity
U.S.L. : Upper Standard Level,
Max.
U.S.L × 1.2
U.S.L × 2.0
-
V
F
I
R
I
V
L.S.L. : Lower Standard Level,
I
F
=
20
mA
V
R
=
5
V
I
F
=
20
mA
-
-
L.S.L × 0.5
SSC-QP-7-03-44(
갑
)
8
SEOUL SEMICONDUCTOR CO., LTD.
SEOUL [ Seoul Semiconductor ]
