ORDERING INFORMATION
SPECIFIED
TEMPERATURE
RANGE
PIN-
PACKAGE
ORDERING
NUMBER
PACKAGE
MARKING
PACKAGE
OPTION
MODEL
VOUT(V)
SGM2008-1.8
SGM2008-2.5
SGM2008-2.7
SGM2008-2.8
SGM2008-2.85
SGM2008-2.9
SGM2008-3.0
SGM2008-3.3
SGM2008-3.6
1.8V
2.5V
2. 7V
2.8V
2.85V
2.9V
3.0V
3.3V
3.6V
SGM2008-1.8XN5/TR
SGM2008-2.5XN5/TR
SGM2008-2. 7XN5/TR
SGM2008-2.8XN5/TR
SGM2008-2.85XN5/TR
SGM2008-2.9XN5/TR
SGM2008-3.0XN5/TR
SGM2008-3.3XN5/TR
SGM2008-3.6XN5/TR
X818
X825
X827
X828
X82J
X829
X830
X833
X836
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
SOT23-5
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
- 40°C to +125°C
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 3000
ABSOLUTE MAXIMUM RATINGS
IN to GND.....................................................................- 0.3V to +6V
Output Short-Circuit Duration ...........................................Infinite
Package Thermal Resistance
SOT23-5, θJA....................................................................... 250℃/W
Operating Temperature Range...........................- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).......................................260°C
to GND.................................................................- 0.3V to +6V
OUT, BP to GND......................................- 0.3V to (VIN + 0.3V)
Power Dissipation, PD @ TA = 25℃
EN
SOT23-5 .....................................................................................0.4W
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
2
SGM2008
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
