ELECTRICAL CHARACTERISTICS (continued)
(VCC Typ = 5 V for L/M/J Models, 3.3 V for T/S Models, 3 V for R Models, 2.5 V for Z Models; unless otherwise noted.)
PARAMETER
OUTPUT VOLTAGE
CONDITIONS
MIN
TYP
MAX
UNITS
RESET/
RESET
V
V
V
V
V
Low (SGM811R/S/T/Z)
Low (SGM811L/M/J)
VCC = VTH(MIN), ISINK = 1.2mA
0.3
0.4
0.3
VCC = VTH(MIN), ISINK = 3.2mA
VCC > 1.0 V, ISINK = 50µA
Low (SGM811R/S/T/Z/L/M/J)
High (SGM811R/S/T/Z)
High (SGM811L/M/J)
VCC > VTH(MAX), ISOURCE = 500µA
VCC > VTH(MAX), ISOURCE = 800µA
VCC = VTH(MAX), ISINK = 1.2mA
VCC = VTH(MAX), ISINK = 3.2mA
1.8 V < VCC < VTH(MIN), ISOURCE = 150µA
0.8×VCC
VCC– 1.5
Low (SGM812R/S/T/Z)
Low (SGM812L/M/J)
0.3
0.4
V
V
V
High (SGM812 R/S/T/Z/L/M/J)
0.8×VCC
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
(Typical values are at TA = 25°C, unless otherwise noted.)
Terminal Voltage (With Respect to Ground)
VCC................................................................................–0.3 V to +6 V
All Other Inputs ............................................ –0.3 V to VCC + 0.3 V
Input Current
SOT23-5 .....................................................................................0.4W
SOT143-4.................................................................................. 0.32W
Operating Temperature Range...........................- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).....................................+260°C
ESD Susceptibility
VCC ,
................................................................................ 20 mA
MR
Output Current
RESET,
HBM..........................................................................................4000V
MM..............................................................................................400V
..................................................................... 20 mA
RESET
Power Dissipation, PD @ TA = 25℃
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
PIN DESCRIPTION
Pin Number
SGM811
SGM812
NAME
FUNCTION
SOT143-4 SOT23-5 SOT143-4
GND
NC
1
1
2
1
Ground
No connect.
Active Low Logic Output.
remains low while VCC is below the reset
then remains low for at least 160 ms after
RESET
RESET
threshold or when
is low;
RESET
MR
VCC rises above the reset threshold.
Active High Logic Output. RESET remains high while VCC is below the reset
threshold or when is low; RESET then remains high for 240 ms (typical) after
2
3
—
MR
RESET
—
—
2
VCC rises above the reset threshold.
Manual Reset. This active low debounced input will ignore input pulses of 100 ns or
less (typical) and is guaranteed to accept input pulses of greater than 10 µs. Leave
floating when not used.
3
4
4
5
3
4
MR
VCC
Power supply voltage that is monitored.
4
SGM811/812
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
