ELECTRICAL CHARACTERISTICS
(continued)
(V
CC
Typ = 5 V for L/M/J Models, 3.3 V for T/S Models, 3 V for R Models, 2.5 V for Z Models; unless otherwise noted.)
PARAMETER
RESET/
RESET
OUTPUT VOLTAGE
Low (SGM811R/S/T/Z)
Low (SGM811L/M/J)
Low (SGM811R/S/T/Z/L/M/J)
High (SGM811R/S/T/Z)
High (SGM811L/M/J)
Low (SGM812R/S/T/Z)
Low (SGM812L/M/J)
High (SGM812 R/S/T/Z/L/M/J)
V
CC
= V
TH(MIN)
, I
SINK
= 1.2mA
V
CC
= V
TH(MIN)
, I
SINK
= 3.2mA
V
CC
> 1.0 V, I
SIN
K = 50µA
V
CC
> V
TH(MAX)
, I
SOURCE
= 500µA
V
CC
> V
TH(MAX)
, I
SOURCE
= 800µA
V
CC
= V
TH(MAX)
, I
SINK
= 1.2mA
V
CC
= V
TH(MAX)
, I
SINK
= 3.2mA
1.8 V < V
CC
< V
TH(MIN)
, I
SOURCE
= 150µA
0.8×V
CC
0.8×V
CC
V
CC
– 1.5
0.3
0.4
0.3
0.4
0.3
V
V
V
V
V
V
V
V
CONDITIONS
MIN
TYP
MAX
UNITS
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
(Typical values are at T
A
= 25°C, unless otherwise noted.)
Terminal Voltage (With Respect to Ground)
V
CC
................................................................................–0.3 V to +6 V
All Other Inputs ............................................ –0.3 V to V
CC
+ 0.3 V
Input Current
V
CC
,
MR
................................................................................ 20 mA
Output Current
RESET,
RESET
..................................................................... 20 mA
Power Dissipation, P
D
@ T
A
= 25℃
SOT23-5 .....................................................................................0.4W
SOT143-4.................................................................................. 0.32W
Operating Temperature Range...........................- 40°C to +125°C
Junction Temperature...........................................................+150°C
Storage Temperature.............................................- 65°C to +150°C
Lead Temperature (soldering, 10s).....................................+260°C
ESD Susceptibility
HBM..........................................................................................4000V
MM..............................................................................................400V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational
sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
PIN DESCRIPTION
Pin Number
NAME
SGM811
SOT143-4 SOT23-5
GND
1
1
2
2
3
—
SGM812
SOT143-4
1
Ground
No connect.
Active Low Logic Output.
RESET
remains low while V
CC
is below the reset
threshold or when
MR
is low;
RESET
then remains low for at least 160 ms after
V
CC
rises above the reset threshold.
Active High Logic Output. RESET remains high while V
CC
is below the reset
threshold or when
MR
is low; RESET then remains high for 240 ms (typical) after
V
CC
rises above the reset threshold.
Manual Reset. This active low debounced input will ignore input pulses of 100 ns or
less (typical) and is guaranteed to accept input pulses of greater than 10 µs. Leave
floating when not used.
Power supply voltage that is monitored.
4
FUNCTION
NC
RESET
RESET
—
—
2
MR
V
CC
3
4
4
5
3
4
SGM811/812
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
