PACKAGE/ORDERING INFORMATION
MODEL
SGM8531
ORDER NUMBER
SGM8531XN5/TR
SGM8531XS/TR
SGM8532XS/TR
SGM8532XMS/TR
SGM8534XS/TR
SGM8534
SGM8534XS14
SGM8534XTS/TR
SGM8534XTS14
PACKAGE
DESCRIPTION
SOT23-5
SO-8
SO-8
MSOP-8
SO-16
SO-14
TSSOP-16
TSSOP-14
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tube
Tape and Reel, 3000
Tube
MARKING
INFORMATION
8531
SGM8531XS
SGM8532XS
SGM8532XMS
SGM8534XS
SGM8534XS14
SGM8534XTS
SGM8534XTS14
SGM8532
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V-
.................
..
........................
7.5 V
Common-Mode Input Voltage
.................
......
...................
(–V
S
) – 0.5 V to (+V
S
)+0.5V
Storage Temperature Range......
............
–65℃ to +150℃
Junction Temperature ......
............
......
........................
160℃
Operating Temperature Range ...
.........
–55℃ to +150℃
Package Thermal Resistance @ T
A
= 25℃
SOT23-5,
θ
JA
........................
......
................................ 190
℃
/W
SO-8,
θ
JA
.............................
.....
....................................125
℃
/W
MSOP-8,
θ
JA
..............
.....
........................................... 216
℃
/W
SO-16,
θ
JA
...................
.......
........................................... 82
℃
/W
TSSOP-16,
θ
JA
................
......
...................................... 105
℃
/W
Lead Temperature Range (Soldering 10 sec)
.....................................................
260℃
ESD Susceptibility
HBM............................................
.....
...............................4000V
MM...............................
.................
....................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
３
SGM8531/8532/8534
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
