PACKAGE/ORDERING INFORMATION
MODEL
ORDER NUMBER
SGM8631XC5/TR
SGM8631
SGM8631XN5/TR
SGM8631XS/TR
SGM8632
SGM8633
SGM8634
SGM8632XMS/TR
SGM8632XS/TR
SGM8633XN6/TR
SGM8633XS/TR
SGM8634XS/TR
SGM8634XTS
PACKAGE
DESCRIPTION
SC70-5
SOT23-5
SO-8
MSOP-8
SO-8
SOT23-6
SO-8
SO-16
TSSOP-16
PACKAGE
OPTION
Tape and Reel, 3000
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 3000
Tape and Reel, 2500
Tape and Reel, 2500
Tape and Reel, 3000
MARKING
INFORMATION
8631
8631
SGM8631XS
SGM8632XMS
SGM8632XS
8633
SGM8633XS
SGM8634XS
SGM8634XTS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- .
...........................................
7.5 V
Common-Mode Input Voltage
....................................
(–V
S
) – 0.5 V to (+V
S
) +0.5V
Storage Temperature Range
.....................
–65℃ to +150℃
Junction Temperature
.................................................
160℃
Operating Temperature Range
.................
–55℃ to +150℃
Package Thermal Resistance @ T
A
= 25℃
SC70-5,
θ
JA
............................
.................
................... 333
℃
/W
SOT23-5,
θ
JA
........................
......
................................ 190
℃
/W
SOT23-6,
θ
JA
..........
.................
................................... 190
℃
/W
SO-8,
θ
JA
.............................
.....
....................................125
℃
/W
MSOP-8,
θ
JA
..............
.....
........................................... 216
℃
/W
SO-16,
θ
JA
...................
.......
........................................... 82
℃
/W
TSSOP-16,
θ
JA
................
......
...................................... 105
℃
/W
Lead Temperature Range (Soldering 10 sec)
.....................................................
260℃
ESD Susceptibility
HBM............................................
.....
...............................1500V
MM...............................
.................
....................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes could
cause the device not to meet its published
specifications.
３
SGM8631/2/3/4
SGMICRO [ Shengbang Microelectronics Co, Ltd ]
