PACKAGE/ORDERING INFORMATION
ORDER NUMBER
PACKAGE
DESCRIPTION
TEMPERATURE
RANGE
PACKAGE
OPTION
MARKING
INFORMATION
SGM9115ZS/TR
SGM9115XS/TR
SO-8
SO-8
0℃ to +70℃
-40℃ to +125℃
Tape and Reel, 2500
Tape and Reel, 2500
SGM9115ZS
SGM9115XS
PIN CONFIGURATIONS
(Top View)
SGM9115
IN1
IN2
IN3
+V
S
1
2
3
4
SO-8
8
7
6
5
OUT1
OUT2
OUT3
GND
PIN DESCRIPTION
PIN
1
2
3
4
5
6
7
8
NAME
IN1
IN2
IN3
+V
S
GND
OUT3
OUT2
OUT1
FUNCTION
Video input, channel 1
Video input, channel 2
Video input, channel 3
Power supply
Ground
Filtered output, channel 3
Filtered output, channel 2
Filtered output, channel 1
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V+ to V- ......................................... 7.5 V
Input Voltage
.......................... GND – 0.3 V to (+V
S
) +0.3V
Storage Temperature Range..............–65℃ to +150℃
Junction Temperature ............................................. 160℃
Operating Temperature Range ........... –40℃ to +125℃
Power Dissipation, P
D
@ T
A
= 25℃
SO-8 .............................................................................0.8W
Package Thermal Resistance
SO-8,
θ
JA
................................................................ 128
℃
/W
Lead Temperature Range (Soldering 10 sec)
...................................................... 260℃
ESD Susceptibility
HBM...........................................................................8000V
MM...............................................................................400V
NOTES
1. Stresses above those listed under Absolute Maximum
Ratings may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD if
you don’t pay attention to ESD protection.
Shengbang Micro-electronics recommends that all
integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance
degradation to complete device failure. Precision
integrated circuits may be more susceptible to
damage because very small parametric changes
could cause the device not to meet its published
specifications.
3
SGM9115