GP2W0110YPS/GP2W0114YPS
Low Power Infrared Transceiver
SOLDERING REFLOW PROFILE
Figure 12 shows a straight-line representation of the
recommended temperature profile for the IR solder
reflow process. The temperature profile is divided into
four process sections with three temperature/time
change rates. The temperature/time details are
described in Table 4.
In process 1, the PCB and SMD GP2W0110YPS/
GP2W0114YPS molded pin joints are heated to a tem-
perature of 165°C to activate the flux in the solder
paste. The temperature ramp up rate R
1
should be
within the range of 1°C to 4°C per second. Package
temperature must be kept within the temperature range
specified in order to avoid localized temperature rise in
the resin by the infrared lamp.
In process 2, sufficient time to dry the solder paste
should be provided, a maximum of 120 seconds is rec-
ommended for optimum results. The temperature
should be kept stable with little temperature increase,
preferably staying at the level of 165°C.
Process 3 is solder reflow. In this process, the tem-
perature should be raised to 230°C for 5 seconds, at
the rate of 1°C to 4°C per second (Rate R2) for desired
result. The dwell time above 200°C must not exceed 60
seconds. Beyond 60 seconds, weak and unreliable
connections will result. The temperature should be
then reduced at the rate of -1°C to -4°C per second
(Rate R3). Please note that deformation of the PCB
can also affect the lead pins of the package, which may
break the gold wire used in the transceiver module. Full
verification of the soldering reflow machine is highly
recommended for optimum results.
Table 4. Solder Reflow Parameters
SECTION
Heat Up
Solder Paste Dry
Solder Reflow
Cooling
TEMPERATURE SYMBOL
to 165°C
165°C
165°C to 230°C
200°C ~
R2
R3
1°C to 4°C/sec
-1°C to -4°C/sec.
R1
TEMPERATURE/TIME
(MAX.)
1°C to 4°C/sec
8
IrDA Technical Information
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