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IS471F 参数 Datasheet PDF下载

IS471F图片预览
型号: IS471F
PDF下载: 下载PDF文件 查看货源
内容描述: OPIC光检测器具有内置的信号处理电路的光调制系统, [OPIC Light Detector with Built-in Signal Processing Circuit for Light Modulation System]
分类和应用:
文件页数/大小: 4 页 / 59 K
品牌: SHARP [ SHARP ELECTRIONIC COMPONENTS ]
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IS471F
IS471F
s
Features
1. Impervious to external disturbing lights
due to light modulation system
2. Built-in pulse driver circuit and sync.
detector circuit on the emitter side
3. A wide range of operating supply voltage
( V
CC
: 4.5 to 16V )
OPIC Light Detector with Built-in Signal
Processing Circuit for Light Modulation System
s
Outline Dimensions
Internal connection diagram
Voltage regulator
Comparator
1 Sync.
detector
2 circuit
Demodulator
circuit
4
3
φ
0.8
2- C0.5
Lustered face
0.45
0.95
1.27
0.4
+0.2
-
0.1
P
1
2
3
4
V
CC
V
O
GND
GL
out
17.6
±
1.0
15.5
±
1.0
2.5
±
0.2
1.8
±
0.2
Visible light
4˚ cut-off black
epoxy resin
2.5
( Unit : mm )
Amp.
Oscillator
Detector
center
1.0
MAX.
2.5
±
0.2
4.4
±
0.2
1 2 3 4
2 3
4
2.5
2.0
1. Optoelectronic switches
2. Copiers, printers
3. Facsimiles
0.6
MAX.
4- 0.45
P P P P
=
1.27mm
1
*“OPIC ” ( Optical IC ) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signal-
processing circuit integrated onto a single chip.
s
Absolute Maximum Ratings
Parameter
Supply voltage
Output voltage
Output
Output current
*1
GL output
Output voltage
Power dissipation
Operating temperature
Storage temperature
*2
Soldering temperature
Symbol
V
CC
V
O
I
O
V
GL
P
T
opr
T
stg
T
sol
( Ta= 25˚C)
Rating
- 0.5 to 16
16
50
16
250
- 25 to + 60
- 40 to +100
260
Unit
V
V
mA
V
mW
˚C
˚C
˚C
*1 Applies to GL
out
terminal
*2 For 5 seconds at the position shown in the right figure
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
0.3
MAX.
s
Applications
1.8 1.7
±
0.3
Resin portion
Soldering portion
(Immersed up to bending portion )